Novus Semiconductor is a privately owned quick turn semiconductor backend service provider. Novus's services include dicing, pick & place, assembly, plating, and thin film metallization. We are dedicated to providing the highest quality service and providing unique solutions to our customer's requirements.
The Novus team has extensive experience in overall semiconductor and backend services giving us valuable insights into what is required to provide high quality, quick turn services to an industry where time to market issues are critical.
Leveraging this experience, Novus has the knowledge to provide custom solutions tailored to meet our customer's needs and deliver “on time” service. We are committed to a quality service which is embedded in all processes that we provide.
Novus has extensive experience in handling AlN, GaAs, InP, SiGe, GaN/SiC, Si, Fused Silica, Sapphire and many other substrates. We can handle whole wafers or discrete parts that require multiple process steps. We are your partner in your process and will work with you to provide rapid solutions to meet your business goals.
Brooks O’Quinn is our Director of Services Division. Prior to starting Novus Semiconductor, Brooks was the Operations and Site Manager of Laird Technologies located in RTP, NC. Which is a global industry leading thermal management company, providing solutions with thermoelectric and liquid cooling products.
Prior to Laird Brooks was responsible for the manufacturing and operations for Nextreme Thermal Solutions which was a spinoff company of Research Triangle Institute that was later purchased by Laird. There he developed the manufacturing process for the technology utilizing photolithography, plating, flip chip, metal evaporation, dicing, and MOCVD process tools to achieve a robust manufacturing process for which he was awarded a US patent.